The United States government has initiated an inquiry into Chinese-manufactured chips utilized in Huawei Technologies’ latest smartphone offerings. Concurrently, U.S. officials are engaged in deliberations to assess the efficacy of existing sanctions, all with the ultimate goal of managing geopolitical rivalries.
Over the past two years, the U.S. Commerce Department has implemented stringent measures against both Huawei and China’s chip industry. In the most recent development, the department has expressed the need for additional information concerning the 7nm processor allegedly integrated into Huawei’s new smartphone, the “Mate 60 Pro.” This processor is produced by Semiconductor Manufacturing International Corp (SMIC), a Chinese semiconductor company previously blacklisted by the U.S. and barred from accessing U.S. technology, including that used by Huawei.
Huawei discreetly introduced the Mate 60 Pro smartphone, coinciding with the online launch around the same time as U.S. Commerce Secretary Gina Raimondo’s visit to China last week. Raimondo’s visit is part of a broader effort by senior U.S. officials to strengthen diplomatic ties with China.
The ongoing discussions within U.S. governmental circles, led by Secretary Raimondo, revolve around a central question: Has the United States been successful in curbing China’s technological advancements? The concern underlying this debate is that China could leverage its technological progress to bolster its modern military capabilities. Additionally, this discourse challenges the effectiveness of the primary mechanisms employed by the U.S. to regulate exports of materials, tools, and technological know-how.
On August 30th, Chinese chip companies witnessed a surge in stock prices following reports of Huawei’s launch of the Mate 60 Pro smartphone. Investors anticipate that this smartphone will incorporate a chip capable of supporting 5G systems. Such an achievement would be viewed as a significant win for China’s semiconductor industry.
However, the United States closely monitors Huawei’s technological developments. Earlier, on August 23rd, the Semiconductor Industry Association (SIA), a consortium representing leading global chipmakers based in Washington State, issued a warning. The SIA cautioned that Huawei was establishing a semiconductor panel factory, potentially conducting clandestine semiconductor fabrication operations across China. This covert network aims to aid blacklisted entities in evading U.S. sanctions while continuing to fulfill the Chinese government’s technology aspirations.
The investigation into Chinese chips in Huawei smartphones raises complex questions surrounding international trade, national security, and the evolving dynamics of technology competition between the United States and China.